To enable the production of advanced wafer semiconductors, Lam Research introduces Coronus DX

To enable the production of advanced wafer semiconductors, Lam Research introduces Coronus DX

Manufacturing of sophisticated semiconductors has gotten increasingly difficult due to the hundreds of procedures required to construct nanometer-sized devices on a silicon wafer. Coronus DX is a solution developed by American wafer fabrication equipment manufacturer Lam Research to address this issue. It can deposit a proprietary layer of protective film on both sides of the wafer edge in a single step, assisting in preventing damage and defects that can frequently occur during advanced semiconductor manufacturing.

A brief about to enable the production of advanced wafer semiconductors, Lam Research introduces Coronus DX

It is hailed as the first bevel deposition solution in the market that has been optimized to meet critical manufacturing issues in applications including next-generation logic, 3D NAND, and advanced packaging.  The use of new cutting-edge techniques by chipmakers to produce next-generation chips is made possible by this potent protection, claims Lam Research, which also boosts yield.

Production is difficult and expensive in the 3D chipmaking age, according to Sesha Varadarajan, senior vice president of Lam Research’s Global Products Group. “Building on Lam’s expertise in bevel innovation, Coronus DX helps drive more predictable manufacturing and significantly higher yield, paving the way for adoption of advanced logic, packaging, and 3D NAND production processes that weren’t previously feasible.”

New device structures can be made possible by Coronus DX. Repeated processing layers can build up residues and roughness around the wafer edge, where they may flake off, move to other locations, and result in flaws that lead to a semiconductor device failing. For instance, in 3D packaging applications, back-end-of-line material may migrate and turn into a source of contamination in subsequent processes. Wafer bonding quality may be affected by roll-off in the wafer edge profile. If those flaws are too difficult to remove with etching, Coronus DX applies a thin dielectric layer of protection to the bevel. These frequent problems that could affect semiconductor quality are resolved because to this precise and controllable deposition.

Rangesh Raghavan, corporate vice president & GM, India at Lam Research, stated that “in a complex manufacturing environment, increasing die yield is critical to maximizing fab productivity”. In order to create cutting-edge technologies like Coronus DX and optimize chipmakers’ production processes, close customer collaboration is essential.

Every major semiconductor manufacturer uses the Coronus product line, which debuted in 2007 and has thousands of chambers installed worldwide. The first bevel technique to be validated in large production is Lam’s Coronus product line. By eliminating layers from the edge, its Coronus and Coronus HP solutions are etch products intended to stop flaws. Manufacturing of cutting-edge 3D devices as well as logic, memory, and custom devices uses Coronus solutions. Leading client fabs all over the world are now using Coronus DX in high-volume manufacture.

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